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Coupe Sapphire Substrat -

Commondity: Diamond Back effiler broyage-roues, Retour à effiler broyage-roues, diamant vitrifiés broyage-roues, Back-Meules, Diamond Back broyage-roues.
Application: substrat Cut & Grind simple cristal de silicium, l'arséniure de gallium Cut, Cut & Grind Sapphire Substrat, Cut & Grind LED, Cut & Grind Sapphire plaquette, Cut & Grind Sapphire Chips; Couper & Grind Sapphire Igots, Cut & Grind Silicon Wafer.
Matériel: Diamant;
Bond: vitrifié Binder;
Dimensions: Sous l'exigence de clients.

Dimensions (MM)

matériel

lien

machine apte

D150*H12*T28*W15*X6

Diamond

V/B/N

NTS, EBARA, Disco, Okamoto,

GAXAXY

D202*U20*H30*X2.5

D255*T45*H95*W3*X10

D250*T46*H28*W12*X10

D255*T45*H95*W6*X10*L28

D265*T44.6*H28*W7*X10

D302*T35*H110*W7*X9

D302*T35*H110*W7*X10

D305*H237*T35*W10*X10

D'autres dimensions sont Sous l'exigence de clients

 

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